Press Room
AMD and MediaTek Develop AMD RZ600 Series Wi-Fi 6E Modules to Enhance Laptop and Desktop PC Connectivity Experiences
18 Nov 2021 - 05:00
Laguna Beach, Calif. – November 18, 2021 – MediaTek and AMD (NASDAQ: AMD) today announced a collaboration to co-engineer industry leading Wi-Fi? solutions, starting with the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek’s new Filogic 330P chipset. The Filogic 330P chipset will power next-generation AMD Ryzen-series laptop and desktop PCs in 2022 and beyond, delivering fast Wi-Fi speeds...
MediaTek’s T750 Powers NEC Platforms’ New 5G CPE and Mi-Fi 蘑菇视频 to be Launched in Japan
15 Oct 2021 - 13:00
HSINCHU, Taiwan – October 15, 2021 – MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise equipment (CPE) and mobile Wi-Fi (Mi-Fi) products powered by MediaTek’s T750 5G chipset. This is the first time that MediaTek and NEC Platforms have collaborated on CPE products. These products provide 5G speeds right out of the box and are an affordable broadband alternative to...
MediaTek Becomes First Company in Taiwan to Complete Authoritative Global Information Security Assessment BSIMM
14 Oct 2021 - 09:00
HSINCHU, Taiwan – October 14, 2021 – MediaTek announced the successful implementation of the global software security model Building Security In Maturity Model (BSIMM12), making it the first company in Taiwan to be assessed using the authoritative security evaluation system. MediaTek has also been authorized by MITRE to assign Common Vulnerabilities and Exposures (CVE) as a CVE Numbering...
MediaTek Announces Filogic Connectivity Family with New Filogic 830 and Filogic 630 Wi-Fi 6/6E Chips
30 Sep 2021 - 02:15
HSINCHU, Taiwan – September 30, 2021 – MediaTek today unveiled its new Filogic connectivity family with the introduction of the Filogic 830 Wi-Fi 6/6E system-on-chip (SoC) and Filogic 630 Wi-Fi 6E network interface card (NIC) solutions. MediaTek’s new Filogic series of high-performance Wi-Fi 6/6E chipsets provide reliable connectivity, high computation capabilities and a rich set of features in...
MediaTek Announces Kompanio 900T to Enhance Computing Experiences for Tablets and Notebooks
09 Sep 2021 - 15:00
HSINCHU, Taiwan – September 9, 2021 – MediaTek today announced its new Kompanio? 900T chipset, expanding MediaTek's portfolio of mobile computing solutions for tablets, portable notebooks and other devices. The introduction of Kompanio 900T follows MediaTek’s recent launch of Kompanio 1300T, which is designed for premium tablets. MediaTek’s Kompanio platform combines powerful computing...
MediaTek Announces Dimensity 920 and Dimensity 810 Chips for 5G Smartphones
11 Aug 2021 - 15:00
HSINCHU, Taiwan – August 11, 2021 – MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays to their customers.
MediaTek Introduces the Kompanio 1300T Platform to Enhance Premium Computing Experiences in Tablets
27 Jul 2021 - 14:30
HSINCHU, Taiwan – July 27, 2021 – MediaTek today announced the launch of its Kompanio 1300T, a SoC designed to power incredible experiences across computing devices. Built on the leading 6nm process technology, the chip is bringing premium performance to tablets with advanced 5G, multimedia, AI and gaming technologies for a premium user experience. Kompanio 1300T allows OEMs to build powerful,...
MediaTek Launches Helio G96 and Helio G88 SoCs Bringing Advanced Display and Photography Capabilities to Premium Smartphones
15 Jul 2021 - 13:30
HSINCHU, Taiwan – July 15, 2021 – MediaTek today announced two additions to its Helio G series: Helio G96 and Helio G88. The launch of these system-on-chips (SoCs) will give device makers the ability to provide powerful smartphone features with cutting-edge display and photography capabilities to bring intelligent mobile experiences to every customer.
MediaTek Launches Dimensity 5G Open Resource Architecture Giving Device Makers Access to More Customized Consumer Experiences
29 Jun 2021 - 08:30
HSINCHU, Taiwan – June 29, 2021 – MediaTek announced the Dimensity 5G Open Resource Architecture that provides brands with more flexibility to customize key 5G mobile device features to address different market segments. The open resource architecture gives smartphone brands closer-to-metal access to customize features for cameras, displays, graphics, artificial intelligence (AI) processing units...
MediaTek and Tessolve Collaborate to Roll-out Production-ready AIoT Hardware and Android Software
19 May 2021 - 12:00
New Delhi, – May 19, 2021 – MediaTek, the world’s fourth-largest fabless semiconductor company, today announced its collaboration with Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, to accelerate the development of an Edge-AI Enabled Smart Device Eco-system. Tessolve launched the MAGIK2 family nano System on module (SoM)...
Social
