Press Room
MediaTek Launches Flagship Dimensity 9200 Chipset for Incredible Performance and Unmatched Power Savings
08 Nov 2022 - 16:00
HSINCHU, Taiwan – November 8, 2022 – MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6GHz connectivity to consumers around the globe.
MediaTek’s New Dimensity 1080 Brings a Performance Boost to 5G Smartphones
11 Oct 2022 - 09:00
HSINCHU, Taiwan – October 11, 2022 – MediaTek today unveiled the Dimensity 1080, the newest chipset in the company’s popular Dimensity portfolio for 5G smartphones. The new 5G chipset offers a nice performance bump and significantly upgraded camera features compared to its predecessor, the Dimensity 920.
MediaTek Accelerates its Sustainability Goals by Announcing its Commitment to Net Zero Emissions by 2050
27 Sep 2022 - 14:00
HSINCHU, Taiwan – September 27, 2022 – To mitigate greenhouse gas driven climate change and respond to global net zero initiatives, MediaTek’s Board of Directors and its Sustainability Committee have committed to the goal of net zero emissions by 2050. In this drive towards net zero, MediaTek aims to reduce total carbon emissions, as part of its deep commitment to sustainability.
MediaTek Launches Pentonic 700 Chipset for Premium 120Hz 4K Smart TVs
18 Aug 2022 - 20:00
HSINCHU, Taiwan – August 18, 2022 – MediaTek today announced the Pentonic 700, a smart TV system-on-chip (SoC) with a powerful AI processing engine for premium 120Hz 4K TVs. With AI-powered picture quality enhancements, support for Dolby Vision IQ with Precision Detail, integrated 4K120 MEMC and TCON, and gaming optimizations, the Pentonic 700 lets global TV brands elevate the all-around viewing...
蘑菇视频 T830 Platform for 5G CPE Devices Including Fixed Wireless Access Routers and Mobile Hotspots
18 Aug 2022 - 04:30
HSINCHU, Taiwan – August 18, 2022 – MediaTek today announced the latest addition to its 5G portfolio, the T830 platform for 5G fixed wireless access (FWA) routers and mobile hotspot customer-premise equipment (CPE). The T830 is built with MediaTek’s M80 modem which supports advanced Release 16 capabilities for sub-6GHz band operations, making the platform ideal for 5G networks around the globe.
MediaTek Powers World’s First Satellite 5G NTN Smartphone Communication
16 Aug 2022 - 21:00
HSINCHU, Taiwan – August 16, 2022 – MediaTek reached a new 5G milestone by powering a smartphone with a 5G Non-Terrestrial Network (NTN) connection in a lab environment for the first time. Through a transfer of data to ITRI’s Next Generation NodeB network (gNB) test over a Low Earth Orbit (LEO) satellite channel emulated in collaboration with Rohde & Schwarz, MediaTek has demonstrated a...
MediaTek Announces Commitment to Open New Semiconductor Design Center at Purdue University in Indiana
28 Jun 2022 - 00:00
NATIONAL HARBOR, MD USA – June 28, 2022 – Today, leading global fabless chipmaker MediaTek Inc., [joined by Indiana Governor Eric J. Holcomb, Deputy Secretary of Commerce Don Graves, Indiana Secretary of Commerce Bradley B. Chambers, and Purdue College of Engineering’s Dr. Mung Chiang] announced their commitment to accept a state transition assistance package from the Indiana Economic Development...
MediaTek Expands Flagship Smartphone Performance with the Dimensity 9000+
22 Jun 2022 - 07:00
HSINCHU, Taiwan – June 22, 2022 – MediaTek today announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient.
MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity
23 May 2022 - 09:00
HSINCHU, Taiwan – May 23, 2022 – MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with...
MediaTek Announces World’s First Complete Wi-Fi 7 Platforms for Access Points and Clients
23 May 2022 - 09:00
TAIPEI, Taiwan – May 23, 2022 – MediaTek today announced the Filogic 880 and Filogic 380 Wi-Fi 7 platform solutions for high-bandwidth applications in the operator, retail, enterprise and consumer electronics markets. This pair of chips will be among the first Wi-Fi 7 solutions to hit the market, allowing device makers to deliver cutting-edge products with the latest connectivity technology.
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