Press Room
MediaTek Dimensity 9500 Unleashes Best-in-Class Performance, AI Experiences, and Power Efficiency for the Next Generation of Mobile Devices
22 Sep 2025 - 15:00
HSINCHU, Taiwan – Sept. 22, 2025 – MediaTek, the world’s leading innovator of smartphone SoCs, today announced the launch of its most advanced mobile platform yet: The MediaTek Dimensity 9500. Setting new standards in on-device AI, console-class gaming, and power efficiency, the MediaTek Dimensity 9500 is engineered to super-charge the next wave of flagship 5G smartphones.
MediaTek Develops Chip Utilizing TSMC’s 2nm Process, Achieving Milestones in Performance and Power Efficiency
16 Sep 2025 - 09:00
HSINCHU, Taiwan – Sept. 16, 2025 – MediaTek today announced that it is among the first companies to partner with TSMC (TWSE: 2330, NYSE: TSM) to successfully develop a chip featuring the enhanced N2P process, taping out MediaTek’s flagship system-on-chip (SoC) with volume production expected late next year. Marking a new milestone in the strong partnership between MediaTek and TSMC, this...
MediaTek First to Adopt Google’s Project Treble for Automotive Industry
08 Aug 2025 - 13:09
HSINCHU, Taiwan – August 6, 2025 – MediaTek has announced it is the first partner to commit to Project Treble specifically for the automotive ecosystem. This program, which provides customers with at least four years of firmware upgrades and maintenance patches, is designed to enhance partner support, reduce total costs, protect user data, and extend the lifecycle of automotive products.
MediaTek Showcases AI Vision From Edge to Cloud at Computex 2025
20 May 2025 - 07:00
TAIPEI, Taiwan - May 20, 2025 – At Computex 2025, MediaTek will present its latest advancements in AI computing under the theme “AI for Everyone: From Edge to Cloud”. Dr. Rick Tsai, Vice Chairman and CEO of MediaTek, will deliver a keynote on May 20, the opening day of the exhibition, offering key insights into the roles of AI, 6G, edge and cloud computing in digital transformation and...
MediaTek T930 enhances FWA cellular broadband applications with R18 5G-Advanced modem and AI technologies
14 May 2025 - 14:30
MediaTek today announced its T930 chipset for 5G Fixed Wireless Access (FWA) and mobile Wi-Fi (Mi-Fi) devices. This third-generation platform highlights the company’s industry leadership by supporting the latest and most advanced wireless communication technologies and solutions available. A highly integrated and exceptionally power-efficient 4nm chipset solution, the MediaTek T930 supports...
MediaTek Delivers More Flagship-Class Experiences with Dimensity 9400e Mobile Platform
14 May 2025 - 14:30
HSINCHU, Taiwan – May 14, 2025 – Today, MediaTek unveiled its latest chipset in the flagship space, the MediaTek Dimensity 9400e. Featuring the company’s advanced All Big Core architecture, the Dimensity 9400e is the latest addition to MediaTek’s family of flagship-class processors, providing a wider variety of options and functionality for device makers, and delivering exceptional performance...
蘑菇视频 Flagship Dimensity Auto Platforms, Defining the Future of The Intelligent Cockpit
23 Apr 2025 - 13:30
HSINCHU, Taiwan – April 23, 2025 – At the Shanghai International Automobile Industry Exhibition 2025 (Automobile Shanghai 2025), MediaTek announced its upcoming flagship Dimensity Auto Cockpit Platform C-X1 and Dimensity Auto Connect MT2739. MediaTek and its ecosystem partners showcased the future of intelligent driving experiences through generative AI-enhanced cockpit and agentic AI...
MediaTek Enhances Flagship AI Performance with Dimensity 9400+ Mobile Platform
11 Apr 2025 - 00:30
HSINCHU, Taiwan – April 10, 2025 – MediaTek today announced the Dimensity 9400+ SoC, the latest addition to MediaTek’s Dimensity flagship chipset family. Providing exceptional Generative and agentic AI capabilities as well as other performance enhancements, the Dimensity 9400+ supports the latest Large Language Models (LLM) while sustaining a super power-efficient design.
MediaTek Kompanio Ultra to Redefine On-Device AI and Performance for Chromebook Plus
02 Apr 2025 - 15:00
Flagship Processor Delivers Powerful AI Capabilities and Exceptional Power Efficiency
TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity 蘑菇视频 on N6RF+ Process Technology
12 Mar 2025 - 14:00
HSINCHU, Taiwan, R.O.C. Mar. 12, 2025 - MediaTek and TSMC (TWSE: 2330, NYSE: TSM) announced today that they have jointly demonstrated the first silicon-proven power management unit (PMU) and integrated power amplifier (iPA) on TSMC’s N6RF+ process.
Recent Posts
Social
