Press Room
MediaTek Launches Dimensity 5G Open Resource Architecture Giving Device Makers Access to More Customized Consumer Experiences
29 Jun 2021 - 08:30
HSINCHU, Taiwan – June 29, 2021 – MediaTek announced the Dimensity 5G Open Resource Architecture that provides brands with more flexibility to customize key 5G mobile device features to address different market segments. The open resource architecture gives smartphone brands closer-to-metal access to customize features for cameras, displays, graphics, artificial intelligence (AI) processing units...
MediaTek and Tessolve Collaborate to Roll-out Production-ready AIoT Hardware and Android Software
19 May 2021 - 12:00
New Delhi, – May 19, 2021 – MediaTek, the world’s fourth-largest fabless semiconductor company, today announced its collaboration with Tessolve, a Hero Electronix venture and an end-to-end engineering solution partner for semiconductor and product companies, to accelerate the development of an Edge-AI Enabled Smart Device Eco-system. Tessolve launched the MAGIK2 family nano System on module (SoM)...
MediaTek Brings Premium Features to High Tier 5G Smartphones with New 6nm Dimensity 900 5G Chipset
13 May 2021 - 15:00
HSINCHU, Taiwan – May 13, 2021 – MediaTek today announced the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset, built on the 6nm high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast FHD+ 120Hz displays and a 108MP main camera for an all-around incredible experience.
China Mobile Collaborates with Intel, HP and MediaTek to Deliver 5G Connected Modern PC Experiences to World’s Largest Network
13 May 2021 - 13:00
HSINCHU, Taiwan — May 13, 2021 — China Mobile will join forces with HP, Intel and MediaTek to collaborate on 5G-enabled PCs for the next-generation of connected modern PC experiences.
MediaTek and Samsung Introduce World’s First Wi-Fi 6E Enabled 8K TV
06 Apr 2021 - 21:00
HSINCHU, Taiwan – April 6, 2021 – MediaTek and Samsung today introduced the world’s first 8K QLED TV – the flagship Samsung 8K QLED Y21 – powered by MediaTek’s MT7921AU, delivering the fastest connectivity experiences through its cutting-edge Wi-Fi 6E capabilities. Following their announcement of the world’s first Wi-Fi 6 enabled 8K TV in 2020, MediaTek and Samsung are yet again driving the smart...
MediaTek Wi-Fi 6 Chipset Powers New ASUS Gaming Notebooks
17 Mar 2021 - 21:00
HSINCHU, Taiwan – March 17, 2021 – MediaTek today announced its MT7921 Wi-Fi 6 chipset is powering ASUS Republic of Gamers (ROG) and The Ultimate Force (TUF) new gaming notebooks, the first consumer notebooks with MediaTek’s industry leading Wi-Fi 6 connectivity solution.
MediaTek’s MT9638 4K Smart TV Chip Ushers in a New Era of AI-Enabled Interactive Multimedia Experiences
03 Mar 2021 - 15:00
HSINCHU, Taiwan – March 3, 2021 – MediaTek today announced its new 4K smart TV chip, the MT9638, with an integrated high-performance AI processing unit (APU). MT9638 supports cutting-edge AI-enhancement technologies such as AI super resolution, AI picture quality and AI voice assistants, plus variable refresh rate (VRR) and MEMC (motion estimation and motion compensation) so graphics appear...
蘑菇视频 New M80 5G Modem with Support for mmWave and Sub-6 GHz 5G Networks
02 Feb 2021 - 07:00
HSINCHU, Taiwan – February 2, 2021 – MediaTek today announced its new M80 5G modem which combines mmWave and sub-6 GHz 5G technologies onto a single chip. The M80 supports ultra-fast speeds on both non-standalone (NSA) and standalone (SA) architectures, with a peak rate of 7.67 Gbps in the downlink and 3.76 Gbps in the uplink. The M80 also supports dual 5G SIM, dual 5G NSA and SA networks, and...
MediaTek, Swisscom, Ericsson and OPPO Enable 5G Carrier Aggregation and Voice over New Radio
26 Jan 2021 - 15:00
HSINCHU, Taiwan – January 26, 2021 – MediaTek today announced it has reached a 5G carrier aggregation (CA) and Voice over New Radio (VoNR) milestone in collaboration with Swisscom, Ericsson and OPPO, advancing 5G networks across Europe.
MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
20 Jan 2021 - 15:20
HSINCHU, Taiwan – January 20, 2021 – MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line...
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