Press Room
MediaTek and Intelligo to Showcase Multiple AI Voice Solutions at CES 2025
Jan 06, 2025 - 09:00 AM
LAS VEGAS, NV – Jan. 6, 2025 – MediaTek, a global leader in IC design, and Intelligo, a pioneer in edge AI technology, announced that they will collaborate to deliver innovative AI voice solutions for the automotive, smart home, and smart retail markets, which will debut at CES 2025. The cooperation will be dedicated to transforming how users interact with vehicles and smart home devices,...
蘑菇视频 the Dimensity 8400, the First All Big Core Chip for Premium Smartphones
Dec 23, 2024 - 03:30 AM
HSINCHU, Taiwan – Dec. 23, 2024– MediaTek today announced the Dimensity 8400, a premium smartphone chip offering the most powerful Gen-AI performance in its class. Building on the legacy of the flagship Dimensity 9400, the MediaTek Dimensity 8400 brings an All Big Core design to the premium smartphone market for the first time. The All Big Core CPU is paired with a powerful NPU to accelerate...
MediaTek Demonstrates Long Reach 224G SerDes for High-Performance ASIC Designs at 2024 OCP Global Summit | MediaTek
Oct 14, 2024 - 11:00 AM
San Jose, CA – Oct. 14, 2024– At the OCP Global Summit, MediaTek, an industry leader in ASIC with more than 1 billion units shipped and over 70 product tape-outs, will demonstrate its silicon proven long reach 224G SerDes. This marks a significant leap forward in performance, reliability, and efficiency for the highest-performance ASIC applications. The 224G SerDes extends MediaTek’s portfolio,...
MediaTek’s Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for the Latest AI Experiences
Oct 09, 2024 - 11:30 AM
HSINCHU, Taiwan – Oct. 9, 2024– MediaTek today launched the Dimensity 9400, the company’s new flagship smartphone chipset optimized for edge-AI applications, immersive gaming, incredible photography, and more. The Dimensity 9400, the fourth and latest in MediaTek’s flagship mobile SoC lineup, offers a massive boost in performance with its second-generation All Big Core design built on Arm’s v9.2...
MediaTek Integrates NVIDIA TAO ToolKit with NeuroPilot SDK for Accelerated Development of Edge AI Applications in IoT
Jun 05, 2024 - 04:30 PM
TAIPEI, Taiwan – June 5, 2024 – At COMPUTEX 2024, MediaTek announced it will integrate NVIDIA TAO with MediaTek’s NeuroPilot SDK, part of its edge inference silicon roadmap. MediaTek’s support for NVIDIA TAO will create a seamless experience for developers as they bring edge AI (including Generative AI) capabilities to a wide variety of IoT applications powered by MediaTek’s cutting-edge silicon....
MediaTek Joins Arm Total Design to Shape the Future of AI Computing
Jun 04, 2024 - 02:00 PM
TAIPEI, Taiwan – June 4, 2024 – MediaTek announced today at COMPUTEX 2024 that the company has joined Arm Total Design, a fast-growing ecosystem that aims to accelerate and simplify the development of products based on Arm? Neoverse? Compute Subsystems (CSS). Arm Neoverse CSS is designed to meet the performance and efficiency needs of AI applications in the data center, infrastructure systems,...
MediaTek to Unveil 蘑菇视频 for Chromebooks, Smart TVs and Displays at COMPUTEX 2024, Highlighting Demonstrations in AI Processing
Jun 04, 2024 - 09:00 AM
HSINCHU, Taiwan – Jun 04, 2024 – At COMPUTEX 2024, MediaTek will showcase new products and technology demonstrations, featuring highlights in AI, Smart TVs, Chromebooks, IoT and more, in addition to a keynote by Vice Chairman and CEO Dr. Rick Tsai about how MediaTek can enable ubiquitous AI.
MediaTek’s Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables
May 30, 2024 - 09:00 AM
HSINCHU, Taiwan – May 30, 2024 – MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity...
MediaTek Boosts Flagship Smartphone Performance with Dimensity 9300+ SoC
May 07, 2024 - 10:00 AM
HSINCHU, Taiwan – May 7, 2024 – MediaTek today unveiled the Dimensity 9300+, the latest flagship mobile chip in MediaTek’s Dimensity portfolio. The Dimensity 9300+ offers increased clock speeds and is designed to accelerate on-device generative AI processing, offering broader support for LLMs, and other performance enhancements over the Dimensity 9300.
MediaTek launches next-generation ASIC design platform with co-packaged optics solutions at OFC 2024
Mar 20, 2024 - 02:00 PM
San Diego, CA – March 20, 2024 – Ahead of the 2024 Optical Fiber Communication Conference (OFC), MediaTek today announced it is launching a next-generation custom ASIC design platform that includes the heterogeneous integration of both high-speed electrical and optical I/Os in the same ASIC implementation. MediaTek will be demonstrating a serviceable socketed implementation that combines 8x800G...
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