Press Room
MediaTek to Spotlight Next-Gen Satellite Broadband, Video Generative AI, and 6G Ambient Computing Demonstrations at MWC 2024
21 Feb 2024 - 07:00
BARCELONA, Spain – February 21, 2024 – At MWC 2024, MediaTek will showcase several technology demonstrations, featuring next-generation product highlights in NTN, 5G RedCap, and 5G CPE, plus collaborations in Dimensity Auto, as well as novel examples of real-time Generative AI video diffusion and pre-6G ambient computing. MediaTek-powered devices from some of the world’s biggest brands will also...
MediaTek announces the first wave of Wi-Fi Alliance? Wi-Fi CERTIFIED 7? 蘑菇视频
08 Jan 2024 - 10:00
LAS VEGAS, Nevada – January 8, 2024 – MediaTek, one of the first adopters of Wi-Fi 7 technology, today announced that it is working closely within Wi-Fi Alliance to launch a complete first wave of Wi-Fi CERTIFIED 7? products, which will be featured as part of MediaTek’s global ecosystem showcase at CES 2024. In an era where people rely on artificial intelligence to improve their lives and...
MediaTek AI-Super Resolution to improve streaming content on Hisense smart TVs
04 Jan 2024 - 09:00
HSINCHU, Taiwan – January 4, 2024 – MediaTek today is expanding its longstanding relationship with Hisense, the first television brand to utilize Pentonic SoCs, to significantly improve the visual quality of streaming content. Starting in 2024, MediaTek AI-Super Resolution (AI-SR) technology will be integrated and supported across Hisense’s full lineup of smart TVs.
MediaTek’s Chairman Ming-Kai Tsai Awarded Prestigious IEEE Robert N. Noyce Medal
29 Nov 2023 - 08:00
HSINCHU, Taiwan – Nov. 29, 2023 – MediaTek today announced its chairman Ming-Kai Tsai has been awarded the IEEE Robert N. Noyce Medal, one of the most prestigious awards in the electronics industry. Chairman Tsai was recognized for his vision and leadership in the global semiconductor industry, democratizing technology access for billions of people. The award will be presented to Tsai in-person...
MediaTek’s New Dimensity 8300 Chipset Redefines Premium Experiences in 5G Smartphones
21 Nov 2023 - 15:30
HSINCHU, Taiwan. – Nov. 21, 2023 – MediaTek today announced the Dimensity 8300, a power-efficient chipset designed for premium 5G smartphones. As the newest SoC in the Dimensity 8000 lineup, this chipset combines generative AI capabilities, low-power savings, adaptive gaming technology, and fast connectivity to bring flagship-level experiences to the premium 5G smartphone segment.
MediaTek Expands Wi-Fi 7 Portfolio with New Chipsets for Mainstream Devices
17 Nov 2023 - 23:00
LAGUNA BEACH, Calif. – Nov. 17, 2023 – MediaTek, one of the first adopters of Wi-Fi 7 technology, now has the industry’s most comprehensive Wi-Fi 7 portfolio with today’s introduction of the company’s new Filogic 860 and Filogic 360 solutions. Together, these second-generation additions aim to further expand MediaTek’s platform of cutting-edge products that utilize the latest technology...
蘑菇视频 RedCap Solutions to Deliver 5G Data Rates and Impressive Power Efficiency to a Broad Range of IoT Devices
17 Nov 2023 - 02:20
DANA POINT, Calif. – Nov. 17, 2023 – Leveraging its industry expertise in 5G connectivity, MediaTek announced it is expanding its family of modems and chipsets to support 5G RedCap. The new solutions, the M60 modem IP and the MediaTek T300 chipset series, will make it easy for MediaTek to facilitate the transition to 5G-NR for a wide range of applications that require long lasting and efficient...
Industry Analysts Name Best MediaTek-Powered Devices in Inaugural ‘Expect Incredible Awards 2023’
16 Nov 2023 - 04:35
HSINCHU, Taiwan – Nov. 16, 2023 – MediaTek today announced the winners of the first-annual ‘Expect Incredible Awards.’ The award program—judged by respected industry analysts—recognizes the top MediaTek-powered devices across a breadth of markets and industries. Winners were selected based on a variety of factors, including design, performance, and market differentiation. To be eligible, devices...
MediaTek’s New All Big Core Design for Flagship Dimensity 9300 Chipset Maximizes Smartphone Performance and Efficiency
06 Nov 2023 - 19:30
HSINCHU, Taiwan – Nov. 6, 2023 – MediaTek today announced the Dimensity 9300, its newest flagship mobile chip with a one-of-a-kind All Big Core design. The unique configuration combines extreme performance with MediaTek’s industry-leading power efficiency to deliver unmatched user experiences in gaming, video capture, and on-device generative AI processing.
MediaTek Vice Chairman and CEO Receives Global Semiconductor Alliance’s Highest Honor
25 Oct 2023 - 22:00
HSINCHU, Taiwan – Oct. 25, 2023– The Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry, today announced MediaTek’s Vice Chairman and CEO Dr. Rick (Lih Shyng) Tsai as the 2023 winner of the Dr. Morris Chang Exemplary Leadership Award. He will be recognized for this prestigious achievement during the GSA Awards Dinner Celebration on Thursday, December 7, 2023, at...
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