Press Room
MediaTek Brings Premium Features to High Tier 5G Smartphones with New 6nm Dimensity 900 5G Chipset
13 May 2021 - 15:00
HSINCHU, Taiwan – May 13, 2021 – MediaTek today announced the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset, built on the 6nm high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast FHD+ 120Hz displays and a 108MP main camera for an all-around incredible experience.
MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences
20 Jan 2021 - 15:20
HSINCHU, Taiwan – January 20, 2021 – MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line...
蘑菇视频 Its Newest 5G Chipset, Dimensity 700, For Mass Market 5G Smartphones
10 Nov 2020 - 00:00
HSINCHU, Taiwan – November 10, 2020 – MediaTek today unveiled its new Dimensity 700 5G smartphone chipset, a 7nm SoC designed to bring advanced 5G capabilities and experiences to the mass market. The addition of the Dimensity 700 to MediaTek’s Dimensity family of 5G chips gives device makers a full suite of options for 5G smartphone models – from flagship and premium to mid-range and mass market...
MediaTek and Ericsson Perform World’s First Interoperability Test with Three Combinations of NR FDD/TDD Carrier Aggregation Using Dimensity 1000+ Chipset
14 Sep 2020 - 11:00
HSINCHU, Taiwan – September 14, 2020 – MediaTek today announced another milestone in its 5G interoperability tests with Ericsson to prepare for the rollout of 5G standalone (SA) networks. MediaTek and Ericsson were the first to successfully complete all three combinations of new radio (NR) time division duplex (TDD) and frequency division duplex (FDD) carrier aggregation (CA) on a single 蘑菇视频..
Dimensity 5G Chipset Unveiled For First MediaTek Powered 5G Smartphone in the United States
03 Sep 2020 - 22:00
Taipei, Taiwan – September 3, 2020 – MediaTek today announced its newest 5G smartphone chip, the Dimensity 1000C, which debuted first in the United States.
MediaTek Introduces Newest 5G SoC, Dimensity 800U for Ultra Connectivity and Advanced 5G Dual SIM Technology
18 Aug 2020 - 09:00
HSINCHU, Taiwan – Aug. 18, 2020 – MediaTek today announced its newest 5G SoC, the Dimensity 800U, as the latest addition in MediaTek’s Dimensity series family. The 7nm Dimensity 800U chip is designed for multi-core high performance and leading 5G+5G Dual Sim Dual Standby (DSDS) technology. With Dimensity 800U MediaTek continues to accelerate the rollout of 5G technology and deliver premium...
MediaTek’s New Dimensity 820 Chip Brings Incredible 5G Experiences to Smartphones
18 May 2020 - 15:00
TAIPEI, Taiwan – May 18, 2020 – MediaTek today announced the Dimensity 820 system-on-chip (SoC) which is optimized for premium user experiences. The Dimensity 820 delivers ultra-fast 5G speeds, and is feature-packed with MediaTek's latest multimedia, AI and imaging innovations.
蘑菇视频 5G-Integrated Dimensity 1000+ Chip for Smartphones
07 May 2020 - 15:00
HSINCHU, Taiwan – May 7, 2020 – MediaTek today announced enhancements to its Dimensity 5G chipset family with the Dimensity 1000+, an enhanced 5G-integrated chip with a number of leading technologies and upgrades for gaming, video and power-efficiency.
MediaTek Announces Dimensity 800 5G Series Chipsets for New Premium 5G Smartphones
07 Jan 2020 - 22:00
LAS VEGAS, USA – Jan 7, 2020 – MediaTek today introduced its Dimensity 800 Series 5G chipset family that will bring flagship features, power and performance to New Premium mid-range 5G smartphones.
MediaTek Announces Dimensity, World’s Most Advanced 5G Chipset Family, & Dimensity 1000 5G SoC
26 Nov 2019 - 14:00
Taipei, Taiwan – November 26, 2019 – MediaTek today unveiled Dimensity, MediaTek’s family of powerful 5G system-on-chips (SoCs) offering an unrivaled combination of connectivity, multimedia, AI and imaging innovations for premium and flagship smartphones.
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