MediaTek has launched new mainstream chipsets for Wi-Fi 7, the Filogic 860 and 360, growing its portfolio beyond the flagship Filogic 880 and Filogic 380 chipsets launched earlier in 2023.
Powering next-gen access points, the Filogic 860 borrows many of the same innovations as the 880, such as single MAC MLO, and MediaTek Xtra Range? technology, ensuring it performs ahead of competitors, while opting for a triple core Arm Cortex-A73 CPU and multi-gigabit Wi-Fi 7 speeds and seamless tri-band connectivity that offer a compelling upgrade over Wi-Fi 6E.The Filogic 860 platform includes with the following features:
- Industry leading 6nm low-power Wi-Fi design
- Single-MAC MLO support
- Supports 4096-QAM and MRU
- Supports dual-band Wi-Fi 7 with industry-highest dual-band MLO speed, 7.2Gbps
- Dual-band, dual concurrent capabilities with 4T4R for 2.4GHz up to BW40 and 5T5R 4SS for 5GHz up to 160MHz bandwidth
- Support for an additional receive antenna for zero-wait DFS
- Filogic Xtra range support, boosting receiving distance using an extra antenna
The new Filogic 360 is a stand-alone, single chip that combines Wi-Fi 7 and dual Bluetooth 5.4. The chip will empower clients such as smartphones, PCs, laptops, set-top boxes, OTT streaming, and many other devices with best-in-class connectivity in their segment.
Key features of the Filogic 360 include:
- Tri-band selectable Wi-Fi 7 2x2 with up to 2.9Gbps speed
- Supports 4096-QAM and MRU
- 160MHz channel bandwidth support
- Filogic Xtra range support, boosting communication distance by unique Hybrid MLO solution
- Dual Bluetooth 5.4 cores that support simultaneous peripherals for gaming and other applications
- BLE audio with integrated DSP for LC3 codec support
- MediaTek advanced Wi-Fi and Bluetooth coexistence technology ensures both technologies can operate on the 2.4 GHz band seamlessly, without interference
