Press Room
MediaTek and Ericsson Perform World＊s First Interoperability Test with Three Combinations of NR FDD/TDD Carrier Aggregation Using Dimensity 1000+ Chipset
14 Sep 2020 - 11:00
HSINCHU, Taiwan 每 September 14, 2020 每 MediaTek today announced another milestone in its 5G interoperability tests with Ericsson to prepare for the rollout of 5G standalone (SA) networks. MediaTek and Ericsson were the first to successfully complete all three combinations of new radio (NR) time division duplex (TDD) and frequency division duplex (FDD) carrier aggregation (CA) on a single 罌厭弝け..
MediaTek and Intel Advance Partnership to Bring 5G to Next Generation of PCs
06 Aug 2020 - 18:00
HSINCHU, Taiwan 每 Aug. 6, 2020 每 MediaTek today announced advances in its collaboration with Intel to bring 5G experiences to next-generation PCs with the successful development and certification of its 5G modem data card.
MediaTek and Samsung Introduce World＊s First Wi-Fi 6 8K TV
05 Mar 2020 - 10:30
HSINCHU, Taiwan 每 March 5, 2020 每 MediaTek and Samsung today introduced the world＊s first 8K QLED TV equipped with MediaTek＊s custom Wi-Fi 6 chipset, the Samsung 8K QLED Y20 model (Q950, Q900).
MediaTek and Intel Partner to Bring 5G Connectivity to the Next Generation of PCs
25 Nov 2019 - 22:00
HSINCHU, Taiwan 每 November 25, 2019 每 MediaTek today announced it is partnering with Intel to bring MediaTek＊s new 5G modem to PCs. Through this partnership, Intel has been working with MediaTek on the 5G solution for deployment in key consumer and commercial laptop segments. MediaTek is developing the 5G modem and working with partners to manufacture the solution.
MediaTek＊s World-Leading 8K DTV SoC in Volume
08 Nov 2019 - 14:00
HSINCHU, Taiwan 每 November 8, 2019 每 MediaTek (TWSE: 2454) and TSMC (TWSE: 2330, NYSE: TSM) today announced that the industry＊s first 8K digital TV system-on-chip (SoC) manufactured with 12nm technology, the MediaTek S900, has entered volume manufacturing with TSMC. Built on TSMC＊s low-power 12nm FinFET Compact (12FFC) process following the companies＊ close collaboration, the S900 enables the...
MediaTek to Integrate Sony＊s 360 Reality Audio Technology into its Audio Chipset Portfolio
15 Oct 2019 - 09:00
HSINCHU, Taiwan 每 October 15, 2019 每 MediaTek today announced it will integrate Sony＊s innovative 360 Reality Audio technology into MediaTek＊s portfolio of audio solutions. MediaTek＊s audio chipsets are designed to bring high-quality, high resolution audio to sound bars, smart speakers and other connected audio devices. With Sony＊s 360 Reality Audio technology integrated into MediaTek＊s chipsets,...
MediaTek and T-Mobile Complete World＊s First Multi-vendor 5G NR Standalone Data Call
14 Aug 2019 - 02:00
HSINCHU, Taiwan 每 August 14, 2019 每 MediaTek and T-Mobile recently announced the completion of the world＊s first 5G New Radio (NR) standalone data call in a multi-vendor environment.
MediaTek Collaborates with Device Makers and RF Leaders to Stimulate 5G Smartphone Innovation
25 Feb 2019 - 13:00
BARCELONA 每 Feb. 25, 2019 每 Today at MWC 2019, MediaTek announced its collaboration with 5G component suppliers and device makers to deliver a complete, standards-based and optimized 5G solution. Companies collaborating with MediaTek on radio frequency (RF) technology include Oppo, Vivo and top tier RF suppliers, including Skyworks, Qorvo and Murata. The companies are working together to define a...
MediaTek & Keysight Technologies Demonstrate 5G NR Data Call Using Helio M70 Multi-Mode Modem with Integrated Baseband
21 Feb 2019 - 19:00
HSINCHU, Taiwan 每 Feb. 21, 2019 每 MediaTek, a leading fabless semiconductor company, and Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that helps enterprises, service providers, and governments accelerate innovation to connect and secure the world, today announced the successful demonstration of a 5G New Radio IP data transfer call using a 5G multi-mode modem with...
MediaTek and Nokia Successfully Complete Testing of Helio M70 5G Modem and the Nokia AirScale 5G Base Station for Commercial Readiness
20 Feb 2019 - 19:00
BARCELONA 每 Feb. 20, 2019每 MediaTek and Nokia today announced the completion of first wave 5G interoperability testing between the MediaTek Helio M70 5G modem and Nokia AirScale 5G Base Station. This marks a significant milestone for MediaTek and Nokia, who have been collaborating for the past two years to accelerate the rollout of 5G networks and enable the first wave of 5G devices.
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