Press Room
罌厭弝け Flagship Dimensity Auto Platforms, Defining the Future of The Intelligent Cockpit
23 Apr 2025 - 13:30
HSINCHU, Taiwan 每 April 23, 2025 每 At the Shanghai International Automobile Industry Exhibition 2025 (Automobile Shanghai 2025), MediaTek announced its upcoming flagship Dimensity Auto Cockpit Platform C-X1 and Dimensity Auto Connect MT2739. MediaTek and its ecosystem partners showcased the future of intelligent driving experiences through generative AI-enhanced cockpit and agentic AI...
MediaTek Brings Advanced AI Capabilities to Vehicles with New Dimensity Auto Cockpit Chipsets Enabled By NVIDIA Technology
18 Mar 2024 - 06:00
San Jose, Calif. 每 March 18, 2024 每 MediaTek announced today at NVIDIA GTC four new automotive SoCs (systems-on-chip) within its Dimensity Auto Cockpit portfolio, offering powerful AI in-cabin experiences for the next generation of intelligent vehicles. MediaTek＊s Dimensity Auto Cockpit C-X1, C-Y1, C-M1, and C-V1 will come with support for NVIDIA DRIVE OS, allowing automakers to leverage the...
MediaTek Partners With NVIDIA to Provide Full-Scale Product Roadmap to the Automotive Industry
29 May 2023 - 14:30
Taipei, Taiwan 每 May 29, 2023 每 MediaTek today announced a partnership with NVIDIA to deliver a complete range of in-vehicle AI cabin solutions for the next generation of software-defined vehicles. The collaboration combines the strength of each company＊s automotive portfolios to deliver the most compelling solutions for state-of-the-art connected cars.
MediaTek Introduces Dimensity Auto, Empowering Smart Vehicle Technology Innovation
17 Apr 2023 - 09:00
HSINCHU, Taiwan 每 April 17, 2023 每 MediaTek today introduced Dimensity Auto, its next generation automotive platform designed to provide automakers with a wide variety of cutting-edge technologies needed for the future of intelligent, always-connected vehicles. As part of this platform, MediaTek Dimensity Auto offers a comprehensive portfolio that includes Dimensity Auto Cockpit, Dimensity Auto...
MediaTek＊s T750 Powers NEC Platforms＊ New 5G CPE and Mi-Fi 罌厭弝け to be Launched in Japan
15 Oct 2021 - 13:00
HSINCHU, Taiwan 每 October 15, 2021 每 MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise equipment (CPE) and mobile Wi-Fi (Mi-Fi) products powered by MediaTek＊s T750 5G chipset. This is the first time that MediaTek and NEC Platforms have collaborated on CPE products. These products provide 5G speeds right out of the box and are an affordable broadband alternative to...
Imagination Welcomes MediaTek's Innovation in True Heterogeneous Multi-Processing With New SoC Featuring PowerVR Series6 GPU
28 Aug 2013 - 16:15
MediaTek and Imagination working together to create optimal HMP SoCs Sunnyvale, CA 每 28 August 2013- Imagination Technologies (LSE:IMG), a leading multimedia, processor, communications and cloud technologies company, recognizes its partner MediaTek Inc. for its unique deployment of heterogeneous processing.
MediaTek Inc. and MStar Semiconductor, Inc. Announce Merger Agreement
14 Aug 2012 - 14:12
TAIWAN, Hsinchu 每 14 August, 2012每 MediaTek Inc. (TSE:2454˙MediaTek) , a leading fabless semiconductor company for wireless communications and digital multimedia solutions, announced a tender offer on June 22, 2012 to acquire 40% to 48% outstanding shares of MStar Semiconductor, Inc. (TSE:3697˙Mstar). For each MStar share, MediaTek paid 0.794 MediaTek shares and NT$1 in cash. The tender offer...
MediaTek focuses on MEA region for innovative chip design
05 Jun 2011 - 15:41
June 5, 2011每 MediaTek, a leading fabless semiconductor company for wireless communications and digital multimedia solutions, has identified new feature demands from across the region＊s mobile phone users. According to a recent survey conducted by MediaTek with more than a hundred stores across the MEA region, there is a huge demand for handsets supporting up to four SIM cards. This demand stems...
MediaTek and Qualcomm Enter Into Patent Arrangement
20 Nov 2009 - 17:00
SAN DIEGO AND HSINCHU 〞 November 20, 2009〞 Qualcomm Incorporated (Nasdaq: QCOM), a leading developer and innovator of advanced wireless technologies, products and services, and MediaTek, Inc., ( TPE: 2454), a leading fabless semiconductor company for wireless communications and digital multimedia solutions, today announced that they have entered into a broad patent arrangement under each...
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