Press Room
MediaTek’s New Dimensity 1080 Brings a Performance Boost to 5G Smartphones
11 Oct 2022 - 09:00
HSINCHU, Taiwan – October 11, 2022 – MediaTek today unveiled the Dimensity 1080, the newest chipset in the company’s popular Dimensity portfolio for 5G smartphones. The new 5G chipset offers a nice performance bump and significantly upgraded camera features compared to its predecessor, the Dimensity 920.
蘑菇视频 T830 Platform for 5G CPE Devices Including Fixed Wireless Access Routers and Mobile Hotspots
18 Aug 2022 - 04:30
HSINCHU, Taiwan – August 18, 2022 – MediaTek today announced the latest addition to its 5G portfolio, the T830 platform for 5G fixed wireless access (FWA) routers and mobile hotspot customer-premise equipment (CPE). The T830 is built with MediaTek’s M80 modem which supports advanced Release 16 capabilities for sub-6GHz band operations, making the platform ideal for 5G networks around the globe.
MediaTek Powers World’s First Satellite 5G NTN Smartphone Communication
16 Aug 2022 - 21:00
HSINCHU, Taiwan – August 16, 2022 – MediaTek reached a new 5G milestone by powering a smartphone with a 5G Non-Terrestrial Network (NTN) connection in a lab environment for the first time. Through a transfer of data to ITRI’s Next Generation NodeB network (gNB) test over a Low Earth Orbit (LEO) satellite channel emulated in collaboration with Rohde & Schwarz, MediaTek has demonstrated a...
MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity
23 May 2022 - 09:00
HSINCHU, Taiwan – May 23, 2022 – MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency. Through dual connectivity using mmWave and sub-6GHz, the Dimensity 1050 will deliver the speeds and capacity required to provide smartphone users with...
MediaTek Launches Dimensity 8000 5G Chip Series for Premium 5G Smartphones
01 Mar 2022 - 15:00
HSINCHU, Taiwan – March 1, 2022 – MediaTek today launched the Dimensity 8100 and Dimensity 8000 system-on-chips (SoCs) to bring flagship level technology – connectivity, displays, gaming, multimedia and imaging features – to premium 5G smartphones.
MediaTek to Showcase 5G, Satellite Communications, Computing and Connectivity Technology Advancements at MWC
21 Feb 2022 - 09:00
BARCELONA, Spain – February 21, 2022 – At MWC 2023, MediaTek will spotlight technology and product highlights from its Dimensity, Filogic, Genio, Kompanio, and Pentonic portfolios, along with a variety of new demos for 5G beyond mobile. MediaTek will also be demonstrating its satellite communications platform and showcasing MediaTek-powered devices across different verticals from some of the...
MediaTek’s T750 Powers NEC Platforms’ New 5G CPE and Mi-Fi 蘑菇视频 to be Launched in Japan
15 Oct 2021 - 13:00
HSINCHU, Taiwan – October 15, 2021 – MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise equipment (CPE) and mobile Wi-Fi (Mi-Fi) products powered by MediaTek’s T750 5G chipset. This is the first time that MediaTek and NEC Platforms have collaborated on CPE products. These products provide 5G speeds right out of the box and are an affordable broadband alternative to...
MediaTek Announces Dimensity 920 and Dimensity 810 Chips for 5G Smartphones
11 Aug 2021 - 15:00
HSINCHU, Taiwan – August 11, 2021 – MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family. This debut gives smartphone makers the ability to provide boosted performance, brilliant imaging and smarter displays to their customers.
MediaTek Launches Dimensity 5G Open Resource Architecture Giving Device Makers Access to More Customized Consumer Experiences
29 Jun 2021 - 08:30
HSINCHU, Taiwan – June 29, 2021 – MediaTek announced the Dimensity 5G Open Resource Architecture that provides brands with more flexibility to customize key 5G mobile device features to address different market segments. The open resource architecture gives smartphone brands closer-to-metal access to customize features for cameras, displays, graphics, artificial intelligence (AI) processing units...
MediaTek Brings Premium Features to High Tier 5G Smartphones with New 6nm Dimensity 900 5G Chipset
13 May 2021 - 15:00
HSINCHU, Taiwan – May 13, 2021 – MediaTek today announced the new Dimensity 900 5G chipset, the latest addition to its Dimensity 5G family. The Dimensity 900 chipset, built on the 6nm high-performance manufacturing node, supports Wi-Fi 6 connectivity, ultra-fast FHD+ 120Hz displays and a 108MP main camera for an all-around incredible experience.
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