Press Room
MediaTek and Intel Partner to Bring 5G Connectivity to the Next Generation of PCs
25 Nov 2019 - 22:00
HSINCHU, Taiwan – November 25, 2019 – MediaTek today announced it is partnering with Intel to bring MediaTek’s new 5G modem to PCs. Through this partnership, Intel has been working with MediaTek on the 5G solution for deployment in key consumer and commercial laptop segments. MediaTek is developing the 5G modem and working with partners to manufacture the solution.
11 MediaTek Papers Selected for ISSCC 2020, the Highest Amount of Any Technology Company
21 Nov 2019 - 14:00
HSINCHU, Taiwan – November 21, 2019 – The ISSCC (International Solid-State Circuits Conference) 2020 published 11 technical papers submitted by MediaTek, the highest amount selected for a technology company. This prestigious recognition underscores MediaTek’s global reputation as a leading semiconductor company with cutting-edge technology driving the industry forward.
MediaTek Delivers 112G Long Range SerDes IP, Silicon-Proven on 7nm for ASIC Services
09 Nov 2019 - 07:00
CORONADO, California – November 9, 2019 – MediaTek today announced the expansion of its ASIC services with the 112G Long Range (LR) SerDes IP chip. Available with silicon-proven 7nm FinFET process technology, MediaTek’s 112G LR SerDes enables data centers to quickly and efficiently process high volumes of specific types of data, accelerating the speed of computing.
MediaTek’s World-Leading 8K DTV SoC in Volume
08 Nov 2019 - 14:00
HSINCHU, Taiwan – November 8, 2019 – MediaTek (TWSE: 2454) and TSMC (TWSE: 2330, NYSE: TSM) today announced that the industry’s first 8K digital TV system-on-chip (SoC) manufactured with 12nm technology, the MediaTek S900, has entered volume manufacturing with TSMC. Built on TSMC’s low-power 12nm FinFET Compact (12FFC) process following the companies’ close collaboration, the S900 enables the...
MediaTek Collaborates with Microsoft to Accelerate the Development of Internet of Things Solutions
07 Nov 2019 - 11:53
HSINCHU, Taiwan — November, 7, 2019 —MediaTektoday announced it has joined Microsoft Azure Certified for Internet of Things (IoT), ensuring customers get IoT solutions up and running quickly with hardware and software that has been pre-tested and verified to work with Microsoft Azure IoT services. Microsoft Azure Certified for IoT allows businesses to reach customers where they are, working...
MediaTek to Integrate Sony’s 360 Reality Audio Technology into its Audio Chipset Portfolio
15 Oct 2019 - 09:00
HSINCHU, Taiwan – October 15, 2019 – MediaTek today announced it will integrate Sony’s innovative 360 Reality Audio technology into MediaTek’s portfolio of audio solutions. MediaTek’s audio chipsets are designed to bring high-quality, high resolution audio to sound bars, smart speakers and other connected audio devices. With Sony’s 360 Reality Audio technology integrated into MediaTek’s chipsets,...
MediaTek Introduces Highly Integrated Chipset for Feature-Rich 4K UHD Smart TVs
24 Sep 2019 - 06:00
HSINCHU, Taiwan – September 24, 2019 – MediaTek today introduced its newest chipset for smart TVs, the MT5670. The highly integrated chipset lets consumer electronics manufacturers build high quality, feature-rich 4K Ultra High Definition (UHD) digital TVs at affordable price points.
MediaTek Launches MT8516 2-Mic Development Kit to Accelerate Integration of Alexa Voice Service in Connected Devices
05 Sep 2019 - 06:00
HSINCHU, Taiwan – September 5, 2019 – MediaTek today announced the MT8516 2-mic development kit for Alexa Voice Service (AVS). The reference solution aims to help developers build high-quality voice-assistant products, reducing development costs and accelerating the integration process for creating far-field products with Alexa built-in, including multi-room music (MRM) capabilities.
MediaTek Senior Standards Specialist Johan Johansson Elected to Lead 3GPP RAN2 Working Group
28 Aug 2019 - 10:00
PRAGUE – August 28 – MediaTek today announced that Johan Johansson, Senior Standards Specialist at MediaTek, has been elected as the Chairman of the 3rd Generation Partnership Project (3GPP) RAN Working Group 2.
MediaTek and T-Mobile Complete World’s First Multi-vendor 5G NR Standalone Data Call
14 Aug 2019 - 02:00
HSINCHU, Taiwan – August 14, 2019 – MediaTek and T-Mobile recently announced the completion of the world’s first 5G New Radio (NR) standalone data call in a multi-vendor environment.
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