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    MediaTek Announces Second Smartphone Design Training Program, Offers Intensive Training to Engineers in India

    06 Dec 2017 - 14:00

    New Delhi, December 6th, 2017: MediaTek announced today the launch of its second Smartphone Design Training Program in collaboration with India’s Ministry of Electronics and Information Technology (MeitY). The program, an annual initiative since 2016, nurtures talent in India’s fast-growing handset industry.
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    MediaTek Launches New Chipset to Accelerate the Growth of NB-IoT

    24 Nov 2017 - 14:30

    HSINCHU, Taiwan – November, 24 2017 — MediaTek has announced its newest chipset, MT2621, the industry’s first dual-mode System-on-Chip (SoC) designed for Internet of Things (IoT) applications with both narrow band IoT (NB-IoT) Release 14 (R14) and GSM/GPRS connectivity. The highly power efficient MT2621 chipset brings dual-mode cellular technologies for IoT, and ensures lowest power consumption....
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    Efficient 5G Spectral Utilization shown with World’s First Compact NOMA Chipset

    02 Nov 2017 - 17:00

    HSINCHU, Taiwan – November 2, 2017 – NTT DOCOMO, Inc. (DOCOMO) and MediaTek Inc. (MediaTek) announced today successful field tests of an important new feature for ultra-high speed and high-capacity 5G communication. By combining Non-Orthogonal Multiple Access (NOMA)1 – a technology proposed by DOCOMO - and Multi-User Interference Cancellation (MUIC)2 technology proposed by MediaTek and enabled on...
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    MediaTek collaborates with Google and its GMS Express program to Deliver Certified Android Software, Mobile Services to Device Makers

    01 Nov 2017 - 21:00

    SAN DIEGO, USA and HSINCHU, Taiwan – November 1, 2017 – MediaTek Inc. today announced that it is the first System-on-Chip (SoC) partner for GMS Express, a program designed to provide approved Android software solutions, including GoogleTM Mobile Services (GMS) and Google Compatibility Test Suite (CTS) certification, to device makers.
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    Fraunhofer HHI, Huawei, MediaTek, Nokia, Qualcomm Incorporated, Samsung and Sony Corp Celebrate the Joint Collaborative Team on Video Coding 2017 Primetime Emmy Engineering Award

    26 Oct 2017 - 17:00

    HSINCHU, Taiwan – October 26, 2017 – Fraunhofer HHI, Huawei, MediaTek, Nokia, Qualcomm Incorporated, Samsung and Sony Corp. celebrate the Joint Collaborative Team on Video Coding (JCT-VC) Committee’s receipt of a 2017 Primetime Emmy Engineering Award for its work on the development of the High Efficiency Video Coding (HEVC) standard.
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    MediaTek Announces Interoperability Tests with SoftBank to Drive NB-IoT Development in Japan

    03 Oct 2017 - 07:00

    TOKYO and HSINCHU, Taiwan – Oct. 3, 2017 – MediaTek Inc. today announced it will conduct a series of interoperability tests of NarrowBand IoT connectivity (NB-IoT) with SoftBank Corp. (“SoftBank”), a subsidiary of SoftBank Group Corp., in the first quarter of 2018 to pave the way for development of NB-IoT commercial applications in Japan. This interoperability test will further efforts to advance...
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    Full-Featured MediaTek Smartphone Chipset MT6739 Debuts in India

    27 Sep 2017 - 14:30

    New Delhi, September 27, 2017－MediaTek Inc., the Taiwan-based global fabless semi-conductor leader, introduced its MT6739 chipset today at India Mobile Congress 2017, the first mobile conference of its kind in the region. The high-speed quad-core System on Chip (SoC) is built for India’s rapidly growing 4G market. The MT6739 features an advanced WorldMode LTE Cat.4 modem, dual camera photography...
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    MediaTek Completes Development of 5G Terminal Prototype with Eight Mobile-Phone-Sized Antennas

    21 Sep 2017 - 14:00

    HSINCHU, Taiwan – September 21, 2017 – MediaTek Inc. today announced it successfully completed the development of a 3GPP 5G standard terminal prototype integrated with eight mobile-phone-sized antennas, as part of a collaboration with Huawei on New Radio (NR) interoperability testing (IODT) at a transmission rate of more than 5Gbps. MediaTek is the industry’s first chipset maker to develop...
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    New MediaTek Helio Chipsets Deliver Rich Features to Booming Mid-Range Market

    29 Aug 2017 - 14:00

    HSINCHU, Taiwan – August 29, 2017 — MediaTek Inc. today introduced the newest members of the Helio chipset family, the Helio P23 and Helio P30 system-on-chips (SoCs). The new chipsets, designed to deliver performance and power efficiency, dual camera photography, dual SIM and dual 4G VoLTE capabilities, support the explosion of innovation in the mid market.
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    蘑菇视频 its First NB-IoT SoC and Announces China Mobile Collaboration to Build Industry’s Smallest NB-IoT Module

    29 Jun 2017 - 11:30

    HSINCHU, Taiwan – June 29, 2017 — MediaTek Inc. today unveiled its first narrow band Internet of Things (NB-IoT) System-on-Chip (SoC), the MT2625, and announced a collaboration with China Mobile to build the world’s smallest NB-IoT module (16mm X 18mm) around the chipset. MediaTek’s new ultra-low-power MT2625 SoC supports a full frequency band(from 450MHz to 2.1GHz) of 3GPP R13 (NB1) and R14...
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