MediaTek and AMD have announced a partnership to co-engineer industry-leading Wi-Fi solutions, starting with the AMD RZ600 Series Wi-Fi 6E Modules, which feature the new MediaTek Filogic 330P chip. The AMD RZ600 Series is designed for next-generation AMD Ryzen-series laptops and desktop PCs in 2022 and beyond, delivering faster Wi-Fi speeds with reduced latency and minimal interference from other signals.
To optimize the AMD RZ600 Series Wi-Fi 6E Modules and ensure seamless connectivity experiences for customers, AMD and MediaTek developed and certified PCIe and USB-connected platforms equipped with modern sleep states and advanced power management鈥攅ssential components for contemporary user experiences. Additionally, the optimization process involved rigorous stress testing and compliance with compatibility standards, ultimately reducing development time for OEM customers.
The MediaTek Filogic 330P supports the latest connectivity standards, including 2x2 Wi-Fi 6 (2.4/5GHz) and 6E (6GHz band up to 7.125GHz) with 160MHz channel bandwidth (BW160), enabling ultra-fast 2.4Gbps connectivity. It also supports complete Wi-Fi 6 R2 features, such as UL-MU-MIMO, TWT Info Frames, Broadcast TWT, Dynamic MU SMPS, UL Extended Range, DL Preamble Puncturing, and UL MU Data Disable.
The chipset integrates MediaTek鈥檚 power amplifier (PA) and low-noise amplifier (LNA) technologies to optimize power consumption and minimize platform size, enabling it to be embedded in devices of all sizes.
Additionally, Bluetooth 5.2 (BT/BLE) is built-in, providing direct peripheral connectivity for wireless devices such as mice, keyboards, smartphones, tablets, and smart home devices. MediaTek's advanced Wi-Fi/Bluetooth coexistence technology ensures both networking technologies can operate simultaneously while maintaining reliable connections.
To optimize the AMD RZ600 Series Wi-Fi 6E Modules and ensure seamless connectivity experiences for customers, AMD and MediaTek developed and certified PCIe and USB-connected platforms equipped with modern sleep states and advanced power management鈥攅ssential components for contemporary user experiences. Additionally, the optimization process involved rigorous stress testing and compliance with compatibility standards, ultimately reducing development time for OEM customers.
The MediaTek Filogic 330P supports the latest connectivity standards, including 2x2 Wi-Fi 6 (2.4/5GHz) and 6E (6GHz band up to 7.125GHz) with 160MHz channel bandwidth (BW160), enabling ultra-fast 2.4Gbps connectivity. It also supports complete Wi-Fi 6 R2 features, such as UL-MU-MIMO, TWT Info Frames, Broadcast TWT, Dynamic MU SMPS, UL Extended Range, DL Preamble Puncturing, and UL MU Data Disable.
The chipset integrates MediaTek鈥檚 power amplifier (PA) and low-noise amplifier (LNA) technologies to optimize power consumption and minimize platform size, enabling it to be embedded in devices of all sizes.
Additionally, Bluetooth 5.2 (BT/BLE) is built-in, providing direct peripheral connectivity for wireless devices such as mice, keyboards, smartphones, tablets, and smart home devices. MediaTek's advanced Wi-Fi/Bluetooth coexistence technology ensures both networking technologies can operate simultaneously while maintaining reliable connections.
