The MediaTek Filogic 830 integrates a wide range of features into a compact, ultra-low-power 12nm SoC, enabling device makers to design differentiated solutions for routers, access points, and mesh systems from a single platform. In January 2021, MediaTek was selected to participate in the testbed for Wi-Fi 6E, the latest certification from the Wi-Fi Alliance® for Wi-Fi CERTIFIED 6™ devices with 6GHz support. MediaTek has worked closely with the Wi-Fi Alliance to ensure that the Filogic 830 supports all Wi-Fi Alliance Wi-Fi 6 Release 2 features.
Here are its top 8 features:
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A powerful quad-core Arm Cortex-A53 CPU clocked at up to 2GHz allows device makers to incorporate differentiating software and services—such as anti-virus tools or VPNs—into their designs to create premium devices.
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By leveraging a Wi-Fi Offload Engine along with MAP-E and MAP-T IPv4/IPv6 accelerators, the Filogic 830 reduces the load on the quad-core CPU for network-related processing. This enhancement improves the platform’s energy efficiency and performance, enabling it to support dozens of Wi-Fi users effortlessly.
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Beyond network processing, the Filogic 830 features built-in dual-band Wi-Fi. The dual PHY+MAC supports 1024-QAM, OFDMA, BW160, and 4SS+4SS across 2.4GHz and 5/6GHz RFIC with iFEM. The SoC also offers expandability through PCI-Express and USB2/3 connectivity.
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The MediaTek Filogic 830 is a highly versatile platform, enabling the design of high-performance Wi-Fi 6/6E routers, access points, and mesh networks from a single solution. Examples include:
- A 6Gbps single-chip Wi-Fi 6 platform (2.4GHz + 5GHz 4x4 dual-band concurrent)
- A 7.8Gbps Wi-Fi 6E platform: Filogic 830 (5GHz 4x4) paired with Filogic 630 (2.4GHz 2x2 + 6GHz 2x2).
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Two 2.5GbE connections allow device makers to implement multi-gig wired networking in various configurations, such as dual 2.5GbE (in/out), one 2.5GbE plus multiple GbE connections (the most common setup), or several GbE ports to support teams of wired systems in a mobile environment.
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The Filogic 830 enables MediaTek FastPathâ„¢ technology, which accelerates applications such as gaming and AR/VR by providing low-latency connections when paired with compatible MediaTek Dimensity smartphone chips.
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Manufactured using an advanced 12nm process, the Filogic 830 combines high performance with always-on functionality while maintaining ultra-low power consumption.
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Wi-Fi 6E delivers significant advantages over previous Wi-Fi generations, including lower latency, increased capacity, and higher speeds. Devices using Wi-Fi 6E connections in the 6GHz band can leverage wide 160 MHz channels and uncongested bandwidth to achieve multi-gigabit, low-latency Wi-Fi. This ensures reliable connectivity for demanding applications like streaming, gaming, AR/VR, and more.