MediaTek
製品＆テクノロジー
惭别诲颈补罢别办の最先端の5骋モデムと强力な接続技术
5Gスマートフォン向けMediaTek Dimensityシリーズ
MediaTekは、これまで5G関連の研究開発に1,000億台湾ドル（約33億ドル）以上を投じてきました。また、研究開発の成果として3GPP（5G/携帯電話標準化コンソーシアム）への参加、幅広い5G対応製品に応用できる確かな技術開発基盤と実績を通じ、100社を超える世界の5Gオペレーター、業界パートナー、グローバル企業のエコシステムを構築しました。以下は、5G のIPおよび製品の開発、25件を超える世界の通信事業者との”世界初“となった5Gテクノロジーに関するコラボレーション、およびホワイトペーパーです。これらのこれまでの実績により、当社SoCを搭載した製品はすべてのユーザーの皆様に素晴らしい体験を提供することが出来るのです。
MediaTekの豊富な5G IPは、5G NR（FR1）およびmmWave（FR2）接続ほか、５Gエコシステムの一部であるNB-IoTやサテライトIoTなどのIoT接続にも対応しており、世界中の機器で活用されています。
MediaTek Dimensity 5Gファミリーは、スマートで高速な技術革新を融合させ、世界で最も高性能な5Gデバイスを実現しています。」
MediaTek M80 5Gモデム - mmWaveおよびSub-6GHzセルラー接続
惭别诲颈补罢别办の5骋技术を使用した痴辞狈搁のデモンストレーション
5骋キャリアアグリゲーションの利点のデモンストレーション
MediaTek Dimensity - MediaTekの5G SoCファミリーで驚異的な体験を
MediaTekの5G協力 - Anritsu、Keysight、Rohde & Schwarzとの連携
MediaTekとHuawei: 5G相互運用性テストのためのコラボレーション
MediaTekとNokia: 5G接続のためのコラボレーション
MediaTek Helio M70: 5Gをすべての人へ
5骋のためのスマートビームフォーミング技术
狈辞办颈补および础苍谤颈迟蝉耻との5骋ライブ接続
5G テクノロジーの実績
2023
4月 12, 2023
MediaTek and Inmarsat join forces on two-way satellite communications to smartphones, IoT devices and cars
3月 16, 2023
MediaTek and Ericsson expand 5G deployment options for CSPs
2月 27, 2023
MediaTek and Rohde & Schwarz verify NTN capabilities of Bullitt’s smartphone
2月 24, 2023
MediaTek to showcase its groundbreaking satellite connectivity technology at MWC 2023
2月 16, 2023
MediaTek launches Dimensity 7200 to amplify gaming and photography smartphone experiences
2月 15, 2023
MediaTek and Skylo collaborate on next-gen 3GPP NTN satellite solutions on smartphones and wearables
2022
12月 12, 2022
MediaTek collaborates with Nokia and O2 Telefónica Germany to achieve 5G 2CC Uplink CA
11月 29, 2022
MediaTek partners with Bullitt to power the world’s first satellite-to-mobile messaging smartphone
11月 11, 2022
MediaTek unveils super-fast and power-efficient 5G thin modem solution for unparalleled 5G experiences beyond smartphones
11月 8, 2022
MediaTek launches flagship Dimensity 9200 chipset for incredible performance and unmatched Power Savings
9月 22, 2022
MediaTek, du, and Nokia achieve the highest throughputs in UAE
8月 16, 2022
MediaTek collaborates with Keysight to validate 5G devices with MIMO Antenna Technology
7月 14, 2022
MediaTek cooperates with Optus to achieve a delivery of a 4CC CA 5G Standalone data call in Australian
5月 23, 2022
MediaTek launches first mmWave chipset for seamless 5G smartphone connectivity
5月 17, 2022
MediaTek cooperates with ZTE and Zhejiang Telecom on achieving 300MHz CA
3月 14, 2022
MediaTek supports Keysight to verify 5G NR 3GPP R16 features
2月 28, 2022
MediaTek collaborates with Anritsu to achieve industry first DAPS for 5G NR
1月 29, 2022
MediaTek cooperates with CICT and Hubei Mobile to complete T+F UL verification
1月 28, 2022
MediaTek cooperates with Nokia and China Mobile to achieve new 5G SA speed using CA technology
2021
12月 16, 2021
MediaTek officially launches Dimensity 9000 flagship chip with adoption by global device makers
11月 11, 2021
Rohde & Schwarz collaborates with MediaTek on Wi-Fi 6E production test
11月 9, 2021
MediaTek and Nokia successfully achieve 700MHz + 2.6GHz uplink and downlink Carrier Aggregation verification
10月 25, 2021
Ericsson launches Time-Critical Communication for real-time 5G experiences
10月 21, 2021
MediaTek and Ericsson successfully complete 5G end-to-end network slice management technology
10月 15, 2021
MediaTek’s T750 powers NEC platforms’ new 5G CPE and Mi-Fi products to be launched in Japan
10月 6, 2021
MediaTek and Nokia achieve world first with Carrier Aggregation delivering 3.2 Gbps end user speeds
9月 27, 2021
MediaTek China Mobile first complete the end-to-end verification of 5G network slicing technology
9月 3, 2021
MediaTek and Keysight achieve milestone in 6Gbps data throughput performance with 5G Sub-6 3CC 300 MHz CA connectivity
8月 19, 2021
MediaTek coordinates with Xiamen Telecom to complete 5G commercial network super uplink test
8月 17, 2021
MediaTek cooperate with Anritsu to complete industry first 5G NR OTDOA positioning test
8月 13, 2021
MediaTek cooperates with ZTE and Liaoning Unicom on FAST verification
8月 3, 2021
MediaTek, Nokia and Taiwan Mobile achieve first 5G carrier aggregation call in standalone architecture
8月 2, 2021
MediaTek, Ericsson and Optus complete successful trial 5G NR-DC in Australia
7月 21, 2021
MediaTek cooperates with Ericsson to set uplink speed record on mmWave using carrier aggregation
7月 20, 2021
MediaTek cooperates with MTS and Ericsson to achieve 5G Carrier Aggregation in 4.8-5.0 GHz
5月 17, 2021
MediaTek collaborates with CMCC, Intel and HP to deliver 5G connected modern PC experiences
5月 5, 2021
MediaTek cooperates with Verizon to integrate C-band spectrum with mmWave
4月 14, 2021
Ericsson and MediaTek dual connectivity breakthrough makes the path to 5G Standalone easier
4月 1, 2021
Keysight, MediaTek join forces to establish 5G connectivity based on 3GPP R16
3月 31, 2021
Anritsu MT8000A and MediaTek M80 5G Modem achieve over 7 Gbps downlink throughput with FR1+FR2 dual connectivity
3月 25, 2021
Keysight Solutions Deployed by MediaTek to Validate First 5G Modem with mmWave Spectrum Capabilities
3月 23, 2021
MediaTek cooperates with Rohde & Schwarz on 5G NR protocol conformance
3月 11, 2021
MediaTek cooperates with CMCC to complete NB-IoT R14 multi-carrier network verification
2月 23, 2021
MediaTek cooperates with ZTE and Shandong Unicom on FAST verification
2月 10, 2021
ZTE, China Telecom and MediaTek jointly complete industry's first E2E commercial verification of FAST
2月 5, 2021
Far EasTone and Ericsson dedicated network to accelerate MediaTek's 5G Chipset production
2月 3, 2021
MediaTek cooperates with Far EasTone on 5G mmWave
2020
10月 14, 2020
MediaTek cooperates with China Unicom and China Telecom to complete 5G SA 3.5GHz dual-carrier aggregation test
10月 7, 2020
MediaTek joins OpenRF launch to advance RF front end development and drive Interoperability across the 5G ecosystem
10月 6, 2020
T-Mobile, Ericsson, LG & MediaTek achieve a World’s First 5G NR with Carrier Aggregation
9月 14, 2020
MediaTek and Ericsson perform World’s 1st interoperability test with 3X NR FDD/TDD Carrier Aggregation combinations using Dimensity 1000+
9月 3, 2020
MediaTek Launches T750 5G Chipset for Fixed Wireless Access Routers and Mobile Hotspot CPE Devices
8月 19, 2020
MediaTek Conduct World’s First Public Test of 5G Satellite IoT Data Connection with Inmarsat
8月 18, 2020
MediaTek Dimensity 800U launches to bring Dual 5G SIM tecnnology to mass market smartphones
7月 23, 2020
MediaTek Dimensity 720 launches, bringing premium 5G experiences into mid-tier smartphones
7月 3, 2020
Collaborated with Vodafone to showcase next phase of 5G technology
5月 18, 2020
MediaTek’s New Dimensity 820 Chip Brings Incredible 5G Experiences to Smartphones
5月 13, 2020
ZTE and MediaTek accomplish the Voice Over NR call on 700 MHz band
5月 7, 2020
蘑菇视频 5G-Integrated Dimensity 1000+ Chip for Smartphones
5月 4, 2020
T?Mobile Achieves Significant 5G Firsts with multiple global industry leaders
4月 30, 2020
MediaTek and Huawei Complete 5G Super Uplink Interoperability Testing
4月 8, 2020
Oppo, Ericsson and MediaTek complete 5G VoNR voice and video calling
3月 9, 2020
Successfully completed Dynamic Sharing Spectrum Field Trial with MTS (Russia) and Ericsson
3月 3, 2020
Rohde & Schwarz and MediaTek verify Dynamic Spectrum Sharing (DSS) for 5G NR
2月 28, 2020
Joined Ericsson ecosystem to achieve Ericsson Spectrum Sharing commercial availability
2019
11月 26, 2019
MediaTek announces Dimensity, World’s most advanced 5G chipset family and Dimensity 1000 5G Soc
11月 25, 2019
MediaTek and Intel partner to bring 5G connectivity to the next generation of PCs
8月 28, 2019
MediaTek Senior Standards Specialist Johan Johansson elected to lead 3GPP RAN2 Working Group
8月 19, 2019
MediaTek Senior Standards Specialist Johan Johansson elected to lead 3GPP RAN2 Working Group
8月 16, 2019
MediaTek’s 5G modem technologies pass testing in China, ready to hit smartphones
7月 31, 2019
T-Mobile US 1st standalone data session
7月 23, 2019
Telstra to achieve Australia’s 1st end-to-end standalone call
7月 10, 2019
MediaTek Helio M70 gets award of "5G Pioneering" in China Mobiles Intelligence device quality test report
6月 26, 2019
1st chipset pass IMT-2020 test using 3GPP Dec version
6月 25, 2019